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ICL3237E
Data Sheet July 2004 FN6014.2
15kV ESD Protected, 10nA SupplyCurrent, +3V to +5.5V, 250k/1Mbps, RS-232 Transmitters/Receivers
The Intersil ICL3237E contains 3.0V to 5.5V powered RS-232 transmitters/receivers which meet ElA/TIA-232 and V.28/V.24 specifications, even at VCC = 3.0V. Additionally, it provides 15kV ESD protection (IEC61000-4-2 Air Gap and Human Body Model) on transmitter outputs and receiver inputs (RS-232 pins). Targeted applications are cell phones, PDAs, Palmtops, and notebook and laptop computers where the low operational, and even lower standby, power consumption is critical. Efficient on-chip charge pumps, coupled with the manual powerdown function, reduce the standby supply current to a 10nA trickle. Small footprint packaging, and the use of small, low value capacitors ensure board space savings as well. Data rates greater than 1Mbps (MBAUD = VCC) are guaranteed at worst case load conditions. The ICL3237E is fully compatible with 3.3V only systems, mixed 3.3V and 5.0V systems, and 5.0V only systems. The ICL3237E is a 5 driver, 3 receiver device that also includes a noninverting always-active receiver for "wake-up" capability. Table 1 summarizes the features of the device represented by this data sheet, while Application Note AN9863 summarizes the features of each device comprising the ICL32XX 3V family.
Features
* ESD Protection For RS-232 I/O Pins to 15kV (IEC61000) * Pin Compatible Replacement for MAX3237E * Pin Selectable, Guaranteed Data Rate . . 250kbps/1Mbps * Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V * RS-232 Compatible with VCC = 2.7V * Latch-Up Free * On-Chip Voltage Converters Require Only Four External Capacitors * Manual Powerdown Feature * Flow Through Pinout * Rx and Tx Hysteresis For Improved Noise Immunity * Rx Active in Powerdown; Separate Rx Enable Pin * Guaranteed Minimum Slew Rate . . . . . . . 6V/s or 24V/s * Wide Power Supply Range. . . . . . . . Single +3V to +5.5V * Low Supply Current in Powerdown State . . . . . . . . . .10nA * Pb-free available
Applications
* Any System Requiring RS-232 Communication Ports - Battery Powered, Hand-Held, and Portable Equipment - Laptop Computers, Notebooks, Palmtops - Modems, Printers and other Peripherals - Data Cradles and Cables - Cellular/Mobile Phone
TABLE 1. SUMMARY OF FEATURES NO. OF MONITOR Rx. (ROUTB) 1 (NOTE 1) DATA RATE (kbps) 250/1000 MANUAL POWERDOWN? YES AUTOMATIC POWERDOWN FUNCTION? NO
PART NUMBER ICL3237E NOTE:
NO. OF NO. OF Tx. Rx. 5 3
Rx. ENABLE FUNCTION? YES
READY OUTPUT? NO
1. Data rate is selectable via the MBAUD pin.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright (c) Intersil Americas Inc. 2002-2004. All Rights Reserved All other trademarks mentioned are the property of their respective owners.
ICL3237E Pinout
ICL3237E (SSOP) TOP VIEW
C2+ 1 GND 2 C23 28 C1+ 27 V+ 26 VCC 25 C124 T1IN 23 T2IN 22 T3IN 21 R1OUT 20 R2OUT 19 T4IN 18 R3OUT 17 T5IN 16 R1OUTB 15 MBAUD
Ordering Information
TEMP. PART NUMBER RANGE (oC) ICL3237ECA ICL3237ECAZ (See Note) ICL3237EIA ICL3237EIAZ (See Note) 0 to 70 0 to 70 -40 to 85 -40 to 85 PACKAGE 28 Ld SSOP 28 Ld SSOP (Pb-free) 28 Ld SSOP 28 Ld SSOP (Pb-free) PKG. DWG. # M28.209 M28.209 M28.209 M28.209
V- 4 T1OUT 5 T2OUT 6 T3OUT 7 R1IN 8 R2IN 9 T4OUT 10 R3IN 11 T5OUT 12 EN 13 SHDN 14
*Add "-T" suffix to part number for tape and reel packaging. NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which is compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J Std-020B.
Pin Descriptions
PIN VCC V+ VGND C1+ C1C2+ C2TIN TOUT RIN ROUT ROUTB EN SHDN MBAUD NOTE: 2. These input pins incorporate positive feedback resistors. Once the input is driven to a valid logic level, the feedback resistor maintains that logic level until VCC is removed. System power supply input (3.0V to 5.5V). Internally generated positive transmitter supply (+5.5V). Internally generated negative transmitter supply (-5.5V). Ground connection. External capacitor (voltage doubler) is connected to this lead. External capacitor (voltage doubler) is connected to this lead. External capacitor (voltage inverter) is connected to this lead. External capacitor (voltage inverter) is connected to this lead. TTL/CMOS compatible transmitter Inputs (Note 2). 15kV ESD Protected, RS-232 level (nominally 5.5V) transmitter outputs. 15kV ESD Protected, RS-232 compatible receiver inputs. TTL/CMOS level receiver outputs. TTL/CMOS level, noninverting, always enabled receiver output. Active low receiver enable control; doesn't disable ROUTB output (Note 2). Active low input to shut down transmitters and on-board power supply, to place device in low power mode (Note 2). Input low selects 250kbps data rate, and input high selects 1Mbps data rate (Note 2). FUNCTION
2
ICL3237E Typical Operating Circuit
ICL3237E
C3 (OPTIONAL CONNECTION, NOTE 3) +3.3V 0.1F 28 + 25 1 + 3 24 T1IN 23 T2IN 22 T3IN 19 T4IN 17 T5IN TTL/CMOS LOGIC LEVELS R1OUTB 21 R1OUT R1 20 R2OUT R2 18 R3OUT R3 13 EN 5k 5k 11 R3IN 5k 9 R2IN RS-232 LEVELS 8 R1IN 16 T5 12 T5OUT T4 10 T4OUT T3 7 T3OUT T2 6 T2OUT RS-232 LEVELS C1+ C1C2+ C2T1 V26 VCC 27 V+ 4 + C3 0.1F NOTE 4 C4 0.1F + T1OUT + 5 GND 2 +
C1 0.1F NOTE 4 C2 0.1F
VCC TO CONTROL LOGIC
14 SHDN 15 MBAUD
NOTES: 3. THE NEGATIVE TERMINAL OF C3 CAN BE CONNECTED TO EITHER VCC OR GND. 4. FOR VCC = 3.15V (3.3V -5%), USE C1 - C4 = 0.1F OR GREATER. FOR VCC = 3.0V (3.3V -10%), USE C1 - C4 = 0.22F.
3
ICL3237E
Absolute Maximum Ratings
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V Input Voltages TIN, EN, SHDN, MBAUD . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25V Output Voltages TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2V ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Information
Thermal Resistance (Typical, Note 5)
JA (oC/W)
28 Ld SSOP Package . . . . . . . . . . . . . . . . . . . . . . . 100 Moisture Sensitivity (see Technical Brief TB363) SSOP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1 Maximum Junction Temperature (Plastic Package) . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (Lead Tips Only)
Operating Conditions
Temperature Range ICL3237EC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 70oC ICL3237EI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE: 5. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications
Test Conditions: VCC = 3.15V to 5.5V, C1 - C4 = 0.1F; VCC = 3V, C1 - C4 = 0.22F, Unless Otherwise Specified. Typicals are at TA = 25oC TEST CONDITIONS TEMP (oC) MIN TYP MAX UNITS
PARAMETER DC CHARACTERISTICS Supply Current, Powerdown Disabled Supply Current, Powerdown
All Outputs Unloaded, VCC = 3.15V, SHDN = VCC SHDN = GND
25 25
-
0.3 10
1.0 300
mA nA
LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS Input Logic Threshold Low Input Logic Threshold High TIN, EN, SHDN, MBAUD TIN, EN, SHDN, MBAUD VCC = 3.3V VCC = 5.0V Full Full Full 25 TIN, EN, SHDN, MBAUD (Note 7) EN = VCC (Receivers Disabled) IOUT = 1.6mA IOUT = -1.0mA Full Full Full Full 2.0 2.4 0.5 0.01 0.05 0.8 1.0 10 0.4 V V V V A A V V
Transmitter Input Hysteresis Input Leakage Current Output Leakage Current Output Voltage Low Output Voltage High RECEIVER INPUTS Input Voltage Range Input Threshold Low VCC = 3.3V VCC = 5.0V Input Threshold High Input Hysteresis Input Resistance TRANSMITTER OUTPUTS Output Voltage Swing Output Resistance Output Short-Circuit Current Output Leakage Current VOUT = 12V, VCC = 0V or 3V to 5.5V, SHDN = GND All Transmitter Outputs Loaded with 3k to Ground VCC = V+ = V- = 0V, Transmitter Output = 2V VCC = 3.3V to 5.0V
VCC -0.6 VCC -0.1 -25 0.6 0.8 3 5.0 300 1.2 1.5 1.6 0.5 5 5.4 10M 35 -
Full 25 25 25 25 25
25 2.4 7
V V V V V k
Full Full Full Full
60 25
V mA A
4
ICL3237E
Electrical Specifications
Test Conditions: VCC = 3.15V to 5.5V, C1 - C4 = 0.1F; VCC = 3V, C1 - C4 = 0.22F, Unless Otherwise Specified. Typicals are at TA = 25oC (Continued) TEST CONDITIONS TEMP (oC) MIN TYP MAX UNITS
PARAMETER TIMING CHARACTERISTICS Maximum Data Rate
RL = 3k, One CL = 1000pF Transmitter Switching VCC = 3V to 4.5V, CL = 250pF VCC = 4.5V to 5.5V, CL = 1000pF
MBAUD = GND MBAUD = VCC MBAUD = VCC
Full Full Full 25 25 25 25
250 1000 1000 6 24 4
700 1700 1100 0.15 0.15 200 200 100 25 50 17 40 12
-
kbps kbps kbps s s ns ns ns ns
Receiver Propagation Delay
Receiver Input to Receiver Output, CL = 150pF Normal Operation Normal Operation tPHL - tPLH, Note 6
tPHL tPLH
Receiver Output Enable Time Receiver Output Disable Time Transmitter Skew
MBAUD = GND MBAUD = VCC, VCC = 3.0V
25 25 25 25 25 25
Receiver Skew Transition Region Slew Rate
tPHL - tPLH, CL = 150pF CL = 150pF to 1000pF MBAUD = GND VCC = 3.3V, RL = 3k to 7k, MBAUD = VCC Measured From 3V to CL = 150pF to 2500pF MBAUD = GND -3V or -3V to 3V
30 150 30
ns V/s V/s V/s
ESD PERFORMANCE RS-232 Pins (TOUT, RIN) Human Body Model IEC61000-4-2 Air Gap Discharge IEC61000-4-2 Contact Discharge All Other Pins NOTES: 6. Skew is measured at the input switching points (1.4V). 7. These inputs utilize a positive feedback resistor. The input current is negligible when the input is at either supply rail. Human Body Model 25 25 25 25 15 15 8 2.5 kV kV kV kV
5
ICL3237E Detailed Description
The ICL3237E operates from a single +3V to +5.5V supply, guarantees a 1Mbps minimum data rate (MBAUD = VCC), requires only four small external 0.1F (0.22F for VCC = 3.0V) capacitors, features low power consumption, and meets all EIA/TIA-232 and V.28 specifications. The circuit is divided into three sections: The charge pump, the transmitters, and the receivers. hysteresis to increase noise immunity and decrease errors due to slow input signal transitions. Monitor receivers remain active even during manual powerdown and forced receiver disable, making them extremely useful for Ring Indicator monitoring. Standard receivers driving powered down peripherals must be disabled to prevent current flow through the peripheral's protection diodes (see Figures 2 and 3). This renders them useless for wake up functions, but the corresponding monitor receiver can be dedicated to this task as shown in Figure 3.
VCC RXIN -25V VRIN +25V GND 5k RXOUT GND VROUT VCC
Charge-Pump
Intersil's new ICL32XX family utilizes regulated on-chip dual charge pumps as voltage doublers, and voltage inverters to generate 5.5V transmitter supplies from a VCC supply as low as 3.0V. This allows these devices to maintain RS-232 compliant output levels over the 10% tolerance range of 3.3V powered systems. The efficient on-chip power supplies require only four small, external 0.1F capacitors for the voltage doubler and inverter functions at VCC = 3.3V. See the "Capacitor Selection" section, and Table 3 for capacitor recommendations for other operating conditions. The charge pumps operate discontinuously (i.e., they turn off as soon as the V+ and V- supplies are pumped up to the nominal values), resulting in significant power savings.
FIGURE 1. INVERTING RECEIVER CONNECTIONS
Powerdown Functionality
This 3V device requires a nominal supply current of 0.3mA during normal operation (not in powerdown mode). This is considerably less than the 5mA to 11mA current required of 5V RS-232 devices. The already low current requirement drops significantly when the device enters powerdown mode. In powerdown, supply current drops to 10nA, because the on-chip charge pump turns off (V+ collapses to VCC, Vcollapses to GND), and the transmitter outputs tristate. This micro-power mode makes the ICL3237E ideal for battery powered and portable applications.
Transmitters
The transmitters are proprietary, low dropout, inverting drivers that translate TTL/CMOS inputs to EIA/TIA-232 output levels. Coupled with the on-chip 5.5V supplies, these transmitters deliver true RS-232 levels over a wide range of single supply system voltages. All transmitter outputs disable and assume a high impedance state when the device enters the powerdown mode (see Table 2). These outputs may be driven to 12V when disabled. The ICL3237E guarantees a 1Mbps data rate (MBAUD = VCC) for full load conditions (3k and 250pF), VCC 3.0V, with one transmitter operating at full speed. Under more typical conditions of VCC 3.3V, C1-4 = 0.1F, RL = 3k, and CL = 250pF, one transmitter easily operates at 1.7Mbps. Transmitter inputs incorporate an active positive feedback resistor that maintains the last driven input state in the absence of a forcing signal. Unused transmitter inputs may be left unconnected.
Software Controlled (Manual) Powerdown
On the ICL3237E, the powerdown control is via a simple shutdown (SHDN) pin. Driving this pin high enables normal operation, while driving it low forces the IC into it's powerdown state. Connect SHDN to VCC if the powerdown function isn't needed. Note that all the receiver outputs remain enabled during shutdown (see Table 2). For the lowest power consumption during powerdown, the receivers should also be disabled by driving the EN input high (see next section, and Figures 2 and 3). The time required to exit powerdown, and resume transmission is only 100s.
Receivers
The ICL3237E contains standard inverting receivers that tristate only when the EN control line is driven high. Additionally, it includes a noninverting (monitor) receiver (denoted by the ROUTB label) that is always active, regardless of the state of any control lines. All the receivers convert RS-232 signals to CMOS output levels and accept inputs up to 25V while presenting the required 3k to 7k input impedance (see Figure 1) even if the power is off (VCC = 0V). The receivers' Schmitt trigger input stage uses 6
ICL3237E
TABLE 2. POWERDOWN AND ENABLE LOGIC TRUTH TABLE SHDN INPUT EN INPUT L L H H L H L H
VCC
TRANSMITTER OUTPUTS High-Z High-Z Active Active
RECEIVER OUTPUTS Active High-Z Active High-Z
ROUTB OUTPUT Active Active Active Active
MODE OF OPERATION Manual Powerdown Manual Powerdown w/Rcvr. Disabled Normal Operation Normal Operation w/Rcvr. Disabled
MegaBaud Selection
VCC CURRENT FLOW VOUT = VCC
VCC
In normal operating mode (MBAUD = GND), the ICL3237E transmitters guarantee a 250kbps data rate with worst-case loads of 3k in parallel with 1000pF. This provides compatibility with PC-to-PC communication software, such as LaplinkTM. For higher speed serial communications, the ICL3237E features MegaBaud operation. In MegaBaud operating mode (MBAUD = VCC), the ICL3237E transmitters guarantee a 1Mbps data rate with worst-case loads of 3k in parallel with 250pF for 3.0V < VCC < 4.5V. For 5V 10% operation, the ICL3237E transmitters guarantee a 1Mbps data rate with worst-case loads of 3k in parallel with 1000pF.
Rx POWERED DOWN UART Tx GND SHDN = GND OLD RS-232 CHIP
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN PERIPHERAL
Capacitor Selection
The charge pumps require 0.1F capacitors for 3.3V (5% tolerance) operation. For other supply voltages refer to Table 3 for capacitor values. Do not use values smaller than those listed in Table 3. Increasing the capacitor values (by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without increasing C1's value, however, do not increase C1 without also increasing C2, C3, and C4 to maintain the proper ratios (C1 to the other capacitors). When using minimum required capacitor values, make sure that capacitor values do not degrade excessively with temperature. If in doubt, use capacitors with a larger nominal value. The capacitor's equivalent series resistance (ESR) usually rises at low temperatures and it influences the amount of ripple on V+ and V-.
TABLE 3. REQUIRED CAPACITOR VALUES VCC (V) 3.0 to 3.6 (3.3V 10%) C1 (F) 0.22 0.1 0.047 0.22 C2, C3, C4 (F) 0.22 0.1 0.33 1.0
VCC
TRANSITION DETECTOR TO WAKE-UP LOGIC VCC R1OUTB RX POWERED DOWN UART VOUT = HI-Z R1OUT TX T1IN T1OUT SHDN = GND, EN = VCC R1IN ICL3237E
FIGURE 3. DISABLED RECEIVERS PREVENT POWER DRAIN
Receiver ENABLE Control
This device also features an EN input to control the receiver outputs. Driving EN high disables all the inverting (standard) receiver outputs placing them in a high impedance state. This is useful to eliminate supply current, due to a receiver output forward biasing the protection diode, when driving the input of a powered down (VCC = GND) peripheral (see Figure 2). The enable input has no effect on transmitter nor monitor (ROUTB) outputs.
3.15 to 3.6 (3.3V 5%) 4.5 to 5.5 3.0 to 5.5
Power Supply Decoupling
In most circumstances a 0.1F bypass capacitor is adequate. In applications that are particularly sensitive to power supply noise, decouple VCC to ground with a capacitor of the same value as the charge-pump capacitor C1. Connect the bypass capacitor as close as possible to the IC.
7
Laplink(R) is a registered trademark of Traveling Software.
ICL3237E Operation Down to 2.7V
ICL3237E transmitter outputs meet RS-562 levels (3.7V), at the full data rate, with VCC as low as 2.7V. RS-562 levels typically ensure inter operability with RS-232 devices.
VCC 0.1F +
+ C1
C1+ C1-
VCC
V+
Transmitter Outputs when Exiting Powerdown
Figure 4 shows the response of two transmitter outputs when exiting powerdown mode. As they activate, the two transmitter outputs properly go to opposite RS-232 levels, with no glitching, ringing, nor undesirable transients. Each transmitter is loaded with 3k in parallel with 2500pF. Note that the transmitters enable only when the magnitude of the supplies exceed approximately 3V.
+ C3
ICL3237E + C2 C2TIN ROUT EN VCC SHDN MBAUD T1 TOUT RIN 5k CL C2+ VC4 +
5V/DIV
SHDN
GND or VCC
FIGURE 5. TRANSMITTER LOOPBACK TEST CIRCUIT
5V/DIV. MBAUD = GND 2V/DIV T1IN
T2 VCC = +3.3V C1 - C4 = 0.1F TIME (20s/DIV.)
T1OUT
FIGURE 4. TRANSMITTER OUTPUTS WHEN EXITING POWERDOWN
R1OUT VCC = +3.3V C1 - C4 = 0.1F 2s/DIV.
High Data Rates
The ICL3237E maintains the RS-232 5V minimum transmitter output voltages even at high data rates. Figure 5 details a transmitter loopback test circuit, and Figure 6 illustrates the standard speed loopback test result for a single transmitter driving 1000pF and an RS-232 load at 250kbps. Figure 7 shows the MegaBaud loopback results for a single transmitter driving 250pF and an RS-232 load at 1Mbps. The static transmitters were also loaded with an RS-232 receiver.
FIGURE 6. LOOPBACK TEST AT 250kbps (CL = 1000pF)
5V/DIV. MBAUD = VCC T1IN
T1OUT
R1OUT VCC = +3.3V C1 - C4 = 0.1F 0.5s/DIV.
FIGURE 7. LOOPBACK TEST AT 1Mbps (CL = 250pF)
8
ICL3237E Interconnection with 3V and 5V Logic
The ICL3237E directly interfaces with 5V CMOS and TTL logic families. Nevertheless, with the ICL32XX at 3.3V, and the logic supply at 5V, AC, HC, and CD4000 outputs can drive ICL32XX inputs, but ICL32XX outputs do not reach the minimum VIH for these logic families. See Table 4 for more information.
TABLE 4. LOGIC FAMILY COMPATIBILITY WITH VARIOUS SUPPLY VOLTAGES VCC SYSTEM POWER-SUPPLY SUPPLY VOLTAGE VOLTAGE (V) (V) 3.3 5 5 3.3 5 3.3
Human Body Model (HBM) Testing
As the name implies, this test method emulates the ESD event delivered to an IC during human handling. The tester delivers the charge through a 1.5k current limiting resistor, making the test less severe than the IEC61000 test which utilizes a 330 limiting resistor. The HBM method determines an ICs ability to withstand the ESD transients typically present during handling and manufacturing. Due to the random nature of these events, each pin is tested with respect to all other pins. The RS-232 pins on "E" family devices can withstand HBM ESD events to 15kV.
IEC61000-4-2 Testing
COMPATIBILITY Compatible with all CMOS families. Compatible with all TTL and CMOS logic families. Compatible with ACT and HCT CMOS, and with TTL. ICL32XX outputs are incompatible with AC, HC, and CD4000 CMOS inputs.
15kV ESD Protection
All pins on ICL32XX devices include ESD protection structures, but the ICL32XXE family incorporates advanced structures which allow the RS-232 pins (transmitter outputs and receiver inputs) to survive ESD events up to 15kV. The RS-232 pins are particularly vulnerable to ESD damage because they typically connect to an exposed port on the exterior of the finished product. Simply touching the port pins, or connecting a cable, can cause an ESD event that might destroy unprotected ICs. These new ESD structures protect the device whether or not it is powered up, protect without allowing any latchup mechanism to activate, and don't interfere with RS-232 signals as large as 25V.
The IEC61000 test method applies to finished equipment, rather than to an individual IC. Therefore, the pins most likely to suffer an ESD event are those that are exposed to the outside world (the RS-232 pins in this case), and the IC is tested in its typical application configuration (power applied) rather than testing each pin-to-pin combination. The lower current limiting resistor coupled with the larger charge storage capacitor yields a test that is much more severe than the HBM test. The extra ESD protection built into this device's RS-232 pins allows the design of equipment meeting level 4 criteria without the need for additional board level protection on the RS-232 port. AIR-GAP DISCHARGE TEST METHOD For this test method, a charged probe tip moves toward the IC pin until the voltage arcs to it. The current waveform delivered to the IC pin depends on approach speed, humidity, temperature, etc., so it is difficult to obtain repeatable results.The "E" device RS-232 pins withstand 15kV air-gap discharges. CONTACT DISCHARGE TEST METHOD During the contact discharge test, the probe contacts the tested pin before the probe tip is energized, thereby eliminating the variables associated with the air-gap discharge. The result is a more repeatable and predictable test, but equipment limits prevent testing devices at voltages higher than 8kV. All "E" family devices survive 8kV contact discharges on the RS-232 pins.
9
ICL3237E Typical Performance Curves
6 TRANSMITTER OUTPUT VOLTAGE (V) VOUT+ 4 2 1 TRANSMITTER AT 250kbps OTHER TRANSMITTERS AT 30kbps 0 MBAUD = GND -2 -4 -6 VOUT TRANSMITTER OUTPUT VOLTAGE (V)
VCC = 3.3V, TA = 25oC
6 VOUT+ 4 2 1 TRANSMITTER AT 1Mbps OTHER TRANSMITTERS AT 30kbps 0 MBAUD = VCC -2 VOUT -4 -6
0
1000
2000
3000
4000
5000
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
FIGURE 8. LOW SPEED TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE
25 MBAUD = GND
FIGURE 9. HIGH SPEED TRANSMITTER OUTPUT VOLTAGE vs LOAD CAPACITANCE
90 MBAUD = VCC 70 SLEW RATE (V/s) +SLEW 50
20 SLEW RATE (V/s) +SLEW
15 -SLEW 10 -SLEW
30 -SLEW 10
5
0
1000
2000
3000
4000
5000
0 0 1000 2000 3000 4000 5000 LOAD CAPACITANCE (pF)
LOAD CAPACITANCE (pF)
FIGURE 10. LOW SPEED SLEW RATE vs LOAD CAPACITANCE
FIGURE 11. HIGH SPEED SLEW RATE vs LOAD CAPACITANCE
90
55 MBAUD = GND 50 SUPPLY CURRENT (mA) SUPPLY CURRENT (mA) 45 40 35 30 25 20 0 1000 2000 3000 4000 5000 LOAD CAPACITANCE (pF) 20kbps 120kbps 250kbps
MBAUD = VCC 80 70 60 50
1Mbps
250kbps 40 120kbps 30 20 0 1000 2000 3000 4000 5000 LOAD CAPACITANCE (pF)
FIGURE 12. LOW SPEED SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA
FIGURE 13. HIGH SPEED SUPPLY CURRENT vs LOAD CAPACITANCE WHEN TRANSMITTING DATA
10
ICL3237E Typical Performance Curves
VCC = 3.3V, TA = 25oC (Continued)
NO LOAD ALL OUTPUTS STATIC 3.0 SUPPLY CURRENT (mA) 2.5 2.0 1.5 1.0 0.5 0 2.5
3.5
3.0
3.5
4.0
4.5
5.0
5.5
6.0
SUPPLY VOLTAGE (V)
FIGURE 14. SUPPLY CURRENT vs SUPPLY VOLTAGE
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP): GND TRANSISTOR COUNT: 619 PROCES Si Gate CMOS
11
ICL3237E Shrink Small Outline Plastic Packages (SSOP)
N INDEX AREA E -B1 2 3 L SEATING PLANE -AD -CA 0.25 0.010 GAUGE PLANE H 0.25(0.010) M BM
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE INCHES SYMBOL A A1 A2 B C D MIN 0.002 0.065 0.009 0.004 0.390 0.197 MAX 0.078 0.072 0.014 0.009 0.413 0.220 MILLIMETERS MIN 0.05 1.65 0.22 0.09 9.90 5.00 MAX 2.00 1.85 0.38 0.25 10.50 5.60 NOTES 9 3 4 6 7 8o Rev. 1 3/95

A1 0.10(0.004) A2 C
E e H L N
e
B 0.25(0.010) M C AM BS
0.026 BSC 0.292 0.022 28 0o 8o 0.322 0.037
0.65 BSC 7.40 0.55 28 0o 8.20 0.95
NOTES: 8. Symbols are defined in the "MO Series Symbol List" in Section 2.2 of Publication Number 95. 9. Dimensioning and tolerancing per ANSI Y14.5M-1982. 10. Dimension "D" does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078 inch) per side. 11. Dimension "E" does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side. 12. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 13. "L" is the length of terminal for soldering to a substrate. 14. "N" is the number of terminal positions. 15. Terminal numbers are shown for reference only. 16. Dimension "B" does not include dambar protrusion. Allowable dambar protrusion shall be 0.13mm (0.005 inch) total in excess of "B" dimension at maximum material condition. 17. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation's quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com 12


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